| 摘要 |
PURPOSE:To reduce the size of the package of a semiconductor device by providing the bonding pad of each semiconductor integrated circuit chip mounted in the same package only on the sides corresponding to the peripheral part of an area composed of the semiconductor integrated circuit chips. CONSTITUTION:Bonding pads 3 and 4 for outputting and inputting signals to and from the outside of a package are provided only on the sides corresponding to the peripheral part of an area for semiconductor integrated circuits 1a and 1b used in a multi-chip module, namely, the sides 5, 6, 7, 8, 9, and 10 corresponding to the sides of the two chips 1a and 1b when the chip 1a and 1b are regarded as one chip. Therefore, the two chips 1a and 1b can be directly mounted on the same tab and sealed with a resin. As a result, no restriction is imposed on the layout of tabs. |
