| 摘要 |
PURPOSE:To thin a semiconductor chip entirely by eliminating the distortion of a base at a part for mounting the semiconductor chip, to prevent packaging failure of a semiconductor chip, and to mold the semiconductor chip positively. CONSTITUTION:A die pad 3 and a wiring pattern 4 are provided on an upper surface S1 of a printed wiring board 1. A dummy pattern 5 is provided at a position corresponding to the die pad 3 on a lower surface S2 of the printed wiring board 1. The outer shape and the area of the dummy pattern 5 and those of the die pad 3 are made equal. |
