发明名称 |
Wire bonding method and apparatus |
摘要 |
In a wire bonding apparatus and method which reduces variances of the length of tails of bonding wires without increasing the total wire cutting time, a capillary and a wire cutting clamp are moved up fast 10 and then slowly 11, after the wire is bonded to a second bonding point 1, to a-point slightly below a desired tail length S, and then the capillary and the clamp are moved up slowly 12 so that the clamp is closed to cut the wire and then moved up fast 13 and slowly 14 again.
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申请公布号 |
US5297722(A) |
申请公布日期 |
1994.03.29 |
申请号 |
US19930092032 |
申请日期 |
1993.07.15 |
申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
TAKAHASHI, KUNIYUKI;YAMAZAKI, NOBUTO |
分类号 |
H01L21/60;B23K20/00;(IPC1-7):H01L21/603 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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