| 摘要 |
<p>PURPOSE:To form polysilicon TFTs in particular on a transparent substrate and to provide a technique for packaging this substrate around another picture element array as the technique for packaging the drivers for driving a flat panel display constituted by using TFTs. CONSTITUTION:Picture element driving circuits 2, 3 formed of polysilicon on the transparent substrate are packaged by the bump technique around the substrate 1 of the picture element array formed of the amorphous silicon or polysilicon TFTs. Then, the transparent substrate is used for the driver chip and, therefore, the high-accuracy packaging of the drivers to the flat panel display is possible and since the common molding on the TFT substrate after packaging of the driver chips is possible, the high-fineness display is inexpensively produced with the good accuracy.</p> |
