发明名称 Semiconductor substrate having a silicon-on-insulator structure and method of fabricating the same
摘要 The invention provides a silicon-on-insulator semiconductor substrate structure and a method of fabricating the same. The structure includes a base silicon substrate, a mono-crystalline silicon film formed on the base silicon substrate in a predetermined region, a poly-crystalline silicon film formed on the base silicon substrate in opposite region to the predetermined region, an insulator film formed on the polycrystalline silicon film, and a mono-crystalline silicon layer overlaying both the insulator film and the mono-crystalline silicon film so that the mono-crystalline silicon layer is electrically connected to the base silicon substrate through the mono-crystalline silicon film. The mono-crystalline silicon film permits not the mono-crystalline silicon layer only but also the base silicon substrate to serve as active regions.
申请公布号 US5298449(A) 申请公布日期 1994.03.29
申请号 US19930028932 申请日期 1993.03.08
申请人 NEC CORPORATION 发明人 KIKUCHI, HIROAKI
分类号 H01L21/02;H01L21/304;H01L21/322;H01L21/74;H01L21/762;H01L21/764;H01L27/12;(IPC1-7):H01L21/76 主分类号 H01L21/02
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