MANUFACTURE OF MICROELECTRONIC CIRCUIT PACKAGE,申请号JP19920023693-传众专利搜索

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发明名称	MANUFACTURE OF MICROELECTRONIC CIRCUIT PACKAGE
摘要
申请公布号	JPH0690074(A)	申请公布日期	1994.03.29
申请号	JP19920023693	申请日期	1992.02.10
申请人	INTERNATL BUSINESS MACH CORP <IBM>	发明人	JIYON MAAKU ATOKINSON;RATSUSERU ERUUTSUDO DAROU;JIYON DEEBUITSUDO RAANAADO;RONARUDO JIEEMUZU MOA
分类号	H05K3/18;(IPC1-7):H05K3/18	主分类号	H05K3/18
代理机构		代理人
主权项
地址

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