发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To distinctly form an impress even on a relatively hard material, such as the lead frame, etc., and, at the same time, to automate the offset correcting work. CONSTITUTION:This the device is provided with a wire bonding tool 14, transducer horn 15, and control section 21 which controls them and incorporates a date memory for storing parameters for controlling ordinary bonding operations and parameters used for controlling dummy bonding operations for forming impress on the surfaces to be bonded.
申请公布号 JPH0689918(A) 申请公布日期 1994.03.29
申请号 JP19920238529 申请日期 1992.09.07
申请人 TOSHIBA CORP 发明人 SATO TAKEO;YAMAZAKI MITSUHARU
分类号 H01L21/60;G06T1/00 主分类号 H01L21/60
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