| 发明名称 |
Method for removing composite attached to material by dry etching |
| 摘要 |
A method and apparatus for removing a composite attached to a material to be treated by dry ashing using a gas including a halogen element and a gas including a hydrogen element or using a gas including fluorine, a gas including oxygen and a gas including chlorine in a reaction chamber containing the material therein for use in manufacturing a semiconductor device.
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| 申请公布号 |
US5298112(A) |
申请公布日期 |
1994.03.29 |
| 申请号 |
US19920996864 |
申请日期 |
1992.12.15 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HAYASAKA, NOBUO;ARIKADO, TSUNETOSHI;OKANO, HARUO;HORIOKA, KEIJI |
| 分类号 |
G03F7/42;H01L21/02;H01L21/3213;(IPC1-7):H01L21/306;B44C1/22;C23F1/00;B29C37/00 |
主分类号 |
G03F7/42 |
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