发明名称 Method for producing a non-single crystal semiconductor device
摘要 A MOS-FET transistor is produced on a substrate made of glass which has a non single crystal semiconductor film (2'). The average diameter of a crystal grain in said film is in the range between 0.5 times and 4 times of thickness of said film, and said average diameter is 250 (Aangstroem)-8000 (Aangstroem) , and said film thickness is 500 (Aangstroem)-2000 (Aangstroem). The density of oxygen in the semiconductor film (2') is less than 2*1019/cm3. A photo sensor having PIN structure is also produced on the substrate, to provide an image sensor for a facsimile transmitter together with the transistors. Said film (2') is produced by placing amorphous silicon film on the glass substrate through CVD process using disilane gas, and effecting solid phase growth to said amorphous silicon film by heating the substrate together with said film in nitrogen gas atmosphere. The film (2') thus produced is subject to implantation of dopant for providing a transistor. The film thus produced has high mobility which provides high speed operation of a transistor, and low threshold voltage of a transistor.
申请公布号 US5298455(A) 申请公布日期 1994.03.29
申请号 US19920825552 申请日期 1992.01.27
申请人 TDK CORPORATION;SEMICONDUCTOR ENERGY LAB 发明人 ARAI, MICHIO;IKEDA, MASAAKI;SUGIURA, KAZUSHI;FURUKAWA, NOBUO;KODAMA, MITSUFUMI;YAMAUCHI, YUKIO;SAKAMOTO, NAOYA;FUKADA, TAKESHI;HIROKI, MASAAKI;TAKAYAMA, ICHIROU
分类号 H01L21/20;H01L21/336;H01L29/786;H01L31/105;H04N1/031;(IPC1-7):H01L21/00;H01L21/02 主分类号 H01L21/20
代理机构 代理人
主权项
地址