发明名称 |
Method of and apparatus for multi-image inspection of bonding wire |
摘要 |
An optical system of inspecting bonding wires on a semiconductor by using a camera, focal length and depth adjusting unit, and an illumination device for irradiating brilliantly a desired portion of an inspection object with an illumination light. The focal length and depth adjusting means comprises a plurality of glass plates each having a different focal length and depth, and each bonding wire is inspected at a plurality of levels at a height position of the wire and at a plurality of portions thereof in its longitudinal direction to make a comparison between focal point evaluation quantities or feature quantities at each detected position so that wiring defects can be detected.
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申请公布号 |
US5298989(A) |
申请公布日期 |
1994.03.29 |
申请号 |
US19910666709 |
申请日期 |
1991.03.08 |
申请人 |
FUJITSU LIMITED |
发明人 |
TSUKAHARA, HIROYUKI;OSHIMA, YOSHITAKA;NAKASHIMA, MASATO |
分类号 |
G01N21/956;G01R31/308;(IPC1-7):H04N7/18 |
主分类号 |
G01N21/956 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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