| 摘要 |
PURPOSE:To execute the necessary and suficient irradiation and carry out the inspection simultaneously with the machining by detecting the emission to be generated in the resin decomposition during the machining, and thereby measuring the intensity, and judging the final point of the machining from the change in the emission intensity during the machining. CONSTITUTION:In the excimer laser beam abrasion machining where a through hole is formed in the resin film 3 by irradiating the excimer laser beam 11, the emission to be generated in the resin decomposition during the machining and the intensity is measured, and the final point of the machining is judged from the change in the emission intensity during the machining. A mask 4 where the pattern is selectively formed on a dielectric multilayer film 4B is placed on the resin film 3, the machining is executed by the laser beam which transmits this mask, and the emission intensity is measured through this mask. This constitution allows the necessary and sufficient laser beam irradiation when the output of the laser beam is fluctuated, optical parts are deteriorated, or the film thickness of works to be machined is dispersed, and the defective connection of V/A by unfinished machining and the damage of the substrate electrode film can be prevented. |
