| 摘要 |
PURPOSE:To make it possible to easily and surely produce a resin molding die, with which resin molding can be performed under the condition that the warpage of a package is effectively prevented from developing without the running of molding resin round to the outer side of a semiconductor chip and to the outer side of a heat radiating plate. CONSTITUTION:The inner surface of the cavity 22 of resin molding dies 20 and 21 is formed into a concave shape so as to fill up resin in the direction of the thickness of the molding resin in order to compensate the shrinkage of the molding resin after the molding of the resin. Further, a pocket, which is lower in level than the mold surface, is provided stepwise at the site, to which a semiconductor chip 14 or a heat radiating plate is set, in the resin molding dies 20 and 21. |
