Thin lamellar semiconductor device for contactless integrated circuit or IC card - includes frame with recesses formed on its inner edge zones with at least one through-way passing through frame

摘要

The thin lamellar semiconductor device has its functional semiconductor elements totally embedded in synthetic resin, and includes a frame (7) with recesses (7b) formed on its inner edge zones. At least one throughway (7c) runs laterally through the frame between the inner face and the outer face of the frame. A PCB (2) carries the functional components (3, 4) and its edges fit into one of the recesses in the frame so that the surface carrying the functional components faces inwards. A thin plate (5) has its edges fitted into the other recesses of the frame so that it is positioned opposite the PCB (2). Synthetic resin (10) fills the space enclosed by the PCB, the frame and the thin plate so that these latter elements are sealed by the resin to form one body. ADVANTAGE - Thin, small structure with good reliability and appearance.