发明名称 Transistor power amplifier arrangement for matching circuit - has block of good thermally conducting material soldered onto ends of striplines connected to transistor connection pins
摘要 The amplifier arrangement includes a power transistor (2) whose output connection pins are soldered onto the ends of two parallel striplines (5, 6) formed on a circuit board (1). A block of material with good thermal conductivity, pref. copper, is soldered onto the ends of each of the striplines connected to the transistor connection pins. The side faces (12, 13) of the blocks which face each other form a capacitance and/or inductance between the strip lines. USE/ADVANTAGE - Push-pull circuit temp. gradient along soldering site between connection pins on strip kept extremely small.
申请公布号 DE4231828(A1) 申请公布日期 1994.03.24
申请号 DE19924231828 申请日期 1992.09.23
申请人 ROHDE & SCHWARZ GMBH & CO KG, 81671 MUENCHEN, DE 发明人 HUPFER, KONRAD, DIPL.-ING. (FH), 8058 ERDING, DE;WICKENHAEUSER, HARALD, DIPL.-ING., 8011 ANZING, DE
分类号 H01L23/64;H05K7/20;(IPC1-7):H05K7/20;H05K1/02;H05K1/18;H03F3/21 主分类号 H01L23/64
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