Halbleiteranordnung für die Verwendung in einer Karte.

摘要

A card like semiconductor device comprising a circuit board made of plastic resin and a semiconductor pellet mounted to the circuit board, wherein a metal layer is formed on one surface of the semiconductor pellet on which semiconductor circuit is not formed. The semiconductor pellet is secured to the circuit board by bonding the metal layer to the circuit board and is sealed with a high polymer material on the circuit board.