Full panel electronic packaging structure.

摘要

An electronic packaging structure (1), and a method of making this structure, are disclosed. The electronic packaging structure comprises a full panel, circuitized flexible film semiconductor chip carrier (2) mounted on a circuitized substrate (6) such as a printed circuit board. A plurality of semiconductor chips (4) are mounted on the carrier in a selected pattern, and the carrier, with the chips, is mounted on a matching pattern of bonding sites on the circuitized substrate. Preferably, the circuitized flexible film semiconductor chip carrier is manufactured on a support structure used to facilitate handling of the circuitized flexible film and to facilitate heat transfer from the semiconductor chips mounted on the carrier to a heat sink (20) which is part of the circuitized substrate. Also, the semiconductor chips mounted on the flexible film chip carrier may be tested, and burned in, while on the support structure before the chip carrier, with the chips, is mounted on the circuitized substrate.