发明名称 |
Highly polishable, highly thermally conductive silicon carbide, method of preparation and applications thereof. |
摘要 |
Silicon carbide is produced by chemical vapor deposition at temperatures from 1340-1380 DEG C, deposition chamber pressures of 180-200 torr, H2/methyltrichlorosilane ratio of 4-10 and deposition rate of 1-2 mu m/min. Furthermore, H2 supplied as a part of the gas stream contains less than about 1 part per million (ppm) O2gas, and various means are provided to exclude particulate material from the deposition chamber. The silicon carbide is polishable to <5 ANGSTROM RMS as measured on a Talystep mechanical profiler and has a thermal conductivity of at least about 300 W/mk. The silicon carbide is particularly suitable for applications where high polishability and thermal conductivity is desired, such as hard disc drives and read/write heads of head disc assemblies, and also optical apparatus which require a very high polish. |
申请公布号 |
EP0588479(A1) |
申请公布日期 |
1994.03.23 |
申请号 |
EP19930306023 |
申请日期 |
1993.07.30 |
申请人 |
CVD INCORPORATED |
发明人 |
PICKERING, MICHAEL A.;BURNS LEE E.;GOELA JITENDRA S. |
分类号 |
C01B31/36;B28B21/42;C04B35/565;C04B35/571;C23C16/00;C23C16/01;C23C16/32;C23C16/44;G11B5/73;G11B5/84 |
主分类号 |
C01B31/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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