| 发明名称 |
Method and apparatus for aligning solder balls. |
| 摘要 |
<p>Solder balls (9) are supplied onto an aligning plate (1) having aligned through-holes (4, 5) formed therein. Air is sucked from the bottom of the above described aligning plate to fit and attract solder balls into the above described through-holes. Solder balls are thus aligned with high work efficiency.</p> |
| 申请公布号 |
EP0307591(B1) |
申请公布日期 |
1994.03.23 |
| 申请号 |
EP19880112127 |
申请日期 |
1988.07.27 |
| 申请人 |
HITACHI, LTD. |
发明人 |
FUKASAWA, HIDEYUKI;KOBAYASHI, MAMORU;WANAMI, MASAHIRO |
| 分类号 |
H01L21/48;H01L21/60;H05K3/34;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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