Ball contact for flip-chip devices.

摘要

A contact (11) for a semiconductor device (10) or passive substrate is made up of an array of conductive balls (12), the individual balls (12) of the contact (11) being a compressible material coated with a metal conductive material. The balls (12) in the array are compressed while being bonded to the contact area to provide a larger bond area between the ball (12) and the contact area to which it is bonded.