| 摘要 |
An integrated circuit comprises a semiconductor substrate, a plurality of islands formed at a principal surface of the substrate and isolated from one another by a PN junction, an interlayer insulating film formed to substantially cover the principal surface of the substrate, and a capacitor formed in a selected one of the islands and having a dielectric layer which is formed within an opening formed in the interlayer insulating film above the selected island. The dielectric layer is constituted of a multilayer film including a silicon oxide film and a silicon nitride film extending to cover the interlayer insulating film. A power supply line conductor is formed on the interlayer insulating film, and the silicon nitride film is completely removed from a portion of the interlayer insulating film directly under the power supply line conductor.
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