| 摘要 |
1,025,555. Semi-conductor devices. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. March 8, 1963 [March 13, 1962], No. 9303/63. Heading H1K. In the manufacture of a Peltier device, comprising a plurality of semi-conductor bodies 4, Fig. 2 (not shown), connected in series by current bridges 8, and a cover plate 11, secured to the current bridges, the bridges are soldered on to the semi-conductor bodies using the cover plate, prior to its securement to the bridges, to press the bridges down on to the molten solder 7, such that the adhesive layer 15, connecting the plate to the bridges, is of uniform thickness. The semi-conductor bodies may be of bismuth telluride and the current bridges and cover plate may be of copper. The base plate 1 may also be used to press the current bridges 3 on to the solder, simultaneously with the use of plate 11. The solder may be of a type which expands when solidifying and may contain bismuth. |
