发明名称 SLICING MACHINE
摘要 PURPOSE:To achieve safety when a wafer is being taken out in a slicing machine. CONSTITUTION:An annular cutting blade 2, wherein a cutting edge 2a is provided at the inner surface periphery is rotated, and member to be cut W, which is inserted into an inner hole, is cut in a slicing machine 1. In the slicing machine 1, the member to be cut W is attached to an attaching stage 12, which is provided at an opening and closing door 10 covering the entire surface of the cutting blade 2. A wafer, which is formed by providing cutting lines, is taken out by opening the opening and closing door 10. An inner cover 15, which covers the cutting blade 2 all the time, is provided between the cutting blade 2 and the opening and closing door 12. When the opening and closing door is opened and the cut wafer is taken out, the wafer does not come into contact with the cutting blade, and safety is assured. The cutting blade is not damaged.
申请公布号 JPH0679718(A) 申请公布日期 1994.03.22
申请号 JP19910334204 申请日期 1991.11.22
申请人 NIPPON SPINDLE MFG CO LTD;KYUSHU ELECTRON METAL CO LTD;SUMITOMO SITIX CORP 发明人 KUSHIDA RYOZO
分类号 B24B27/06;B24B55/04;B28D5/00;B28D5/02;B28D7/00;H01L21/304;(IPC1-7):B28D5/00;B28D1/22 主分类号 B24B27/06
代理机构 代理人
主权项
地址