发明名称 |
Curable resin composition |
摘要 |
A curable resin composition has a low viscosity, hence is easy to handle, before curing and, after curing, gives cured products having good tensile characteristics and, in addition, good chemical resistance and water resistance. This composition includes (A) an oxypropylene polymer having at least one silicon atom-containing group having a hydroxyl group or hydrolyzable group bound to the silicon atom and having an Mw/Mn ratio of up to than 1.6 and a number average molecular weight of at least 6,000, and (B) an epoxy resin.
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申请公布号 |
US5296582(A) |
申请公布日期 |
1994.03.22 |
申请号 |
US19910776427 |
申请日期 |
1991.11.18 |
申请人 |
KANEGAFUCHI CHEMICAL INDUSTRY CO., LTD. |
发明人 |
FUJITA, MASAYUKI;HOMMA, MICHIHIDE;WAKABAYASHI, HIROSHI |
分类号 |
C08G65/336;C08L63/00;C08L71/02;(IPC1-7):C08G77/04 |
主分类号 |
C08G65/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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