| 摘要 |
PURPOSE:To suppress a rise of a temperature of a semiconductor integrated circuit. CONSTITUTION:A chip 100 has, in addition to power supply pads 4a wired to leads for supplying power to supply power of the same potential as that of a board, pads 3b adjacent to power supply pads 4 of input/output pads or corresponding to leads adjacent to hanging leads 6. Further, in addition, input/ output pads 3a are provided. The pads 3a having lower priority order than that of the pads 3a are provided adjacent to the pads 4 having the same potential as that of the board of the chip 100 corresponding to the leads adjacent to the leads 6 or similarly to the leads 6. Thus, unwired leads can contribute to heat dissipation. |
