发明名称 DIE BONDING DEVICE
摘要 PURPOSE:To enable a process where a pellet is bonded to a lead frame by thermocompression to be shortened in processing time. CONSTITUTION:A plurality thermocompression bonding stations are provided. On one hand, the position of a pellet 15 is corrected and a preliminary compression bonding of the pellet 15 to a lead frame 16 is performed at a preliminary compression bonding station. On the other hand, another lead frame 16 after the preliminary compression bonding is further subjected to a compression bonding simultaneously at a final compression bonding station to make the bonding more complete.
申请公布号 JPH0677263(A) 申请公布日期 1994.03.18
申请号 JP19920229097 申请日期 1992.08.28
申请人 NEC CORP 发明人 SHIROUCHI TOSHIAKI
分类号 H01L21/52;H01L21/50;(IPC1-7):H01L21/52 主分类号 H01L21/52
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