发明名称 WIRING DEVICE
摘要 PURPOSE:To provide a wiring device which is capable of laying a wire over wiring pins on a wiring board at high speed and at small intervals. CONSTITUTION:A wiring device 1 feeds a wire 7 from a nozzle portion 5 to a plurality of wiring pins 3 erected on a wiring board 2 or a distributing board and lays the wire, and a slide plate 4 is disposed opposite to the ends of the plurality of wiring pins and is provided with the nozzle portion 5. The wiring pins and the slide plate opposite to each other are moved relative to each other and also the wire is fed from the nozzle portion and laid over the wiring pins.
申请公布号 JPH0676655(A) 申请公布日期 1994.03.18
申请号 JP19920226968 申请日期 1992.08.26
申请人 YAZAKI CORP 发明人 KATO SANAE;SUGIYAMA HIROSHI
分类号 H01B13/012;H05K13/00;H05K13/06 主分类号 H01B13/012
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