| 摘要 |
<p>PURPOSE:To produce a multilayer printed wiring board in which connecting lands can be interconnected without requiring through hole plating method. CONSTITUTION:Inner and outer layer printed wiring boards 1, 4, 6 are stuck each other while being aligned to produce a multilayer printed wiring board 15. An electronic component 23 is then mounted by inserting leads 25, each composed of a plurality of thin strands 16, into through holes 12, 13, 14 at connecting lands 8, 9, 10, 11 of printed circuit boards 2, 3, 5, 7. Molten solder 16 is then filled in the through holes 12, 13, 14 by taking advantage of capillary phenomenon of the lead 25. The solder is eventually hardened to establish electrical interconnection of the printed wiring circuits 2, 3, 5, 7 thus producing a multilayer printed wiring circuit 15 incorporating first to fourth printed wiring circuits 2, 3, 5, 7.</p> |
