| 摘要 |
<p>PURPOSE:To provide a semiconductor manufacturing device capable of eliminating dusting from the main surface of wafer, reducing pattern defects and improving yield when fixing wafer inside the device. CONSTITUTION:A recessed portion 2a for placing a wafer 1 is formed on a frame 2 and also a hole 5 is drilled. Piping 4 is connected to this hole 5. At the upper portion of the frame 2, a holding jig 6 is attached around the recessed portion 2a. At the inner peripheral wall end of this holding jig 6, a contact surface 6b slanted from the main surface of the wafer 1 is formed. Thus, by supplying a gas to the inside of the recessed portion 2a through the piping 4 and the hole 5, the wafer 1 is pushed up from the rear surface side, and the outer peripheral end surface of wafer is contacted to and fixed to the contact surface 6b.</p> |
