SEMICONDUCTOR PACKAGE PROVIDED WITH STACKED LEAD AND ITS BONDING METHOD

摘要

PURPOSE: To provide a semiconductor package and its bonding method which can achieve increase of mounting density and making multi-pins of a TAB without changing a chip size and a TAB tape size. CONSTITUTION: A semiconductor package having pads 55' along the outer periphery of a chip 10' comprises the chip 10' and leads to be bonded being formed on the upper surface and the lower surface of an insulating tape, leads on the upper surface being formed longer than leads on the lower surface and the plural pads 55' being distributed in line at the outer periphery of the chip 10' mounted on the TAB tape.