OVERMOLDED SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PURPOSE: To enable a small overmolded type multi-chip semiconductor device to be manufactured at low cost. CONSTITUTION: A first semiconductor die 20 is interconnected to a first electrically conductive trace 14 on a substrate 12, and a package body 24 is formed around the first die and a part of the trace. A second semiconductor die 27 is interconnected to a second trace 16 on a second surface of the substrate. A second package body 28 is formed around the second die and a part of the trace 16. Solder balls are applied to the exposed part of the second trace 16 around the package body 28, to establish an external power supply and ground connection for each die. Edge leads 36 are soldered externally to the traces 14 and 16 around the substrate 12 to establish remaining electrical connections.