SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To mount in a high density on a circuit board in a small size in a semiconductor device of a vertical package. CONSTITUTION:Chip groups in which wiring layers 22b, 23b wired with wiring pattern connected to electrode pads 22a, 23a on semiconductor chips 22, 23 are fixed with molding resin 27a, and packaged. Inner leads 26a of connecting leads 26 for constituting the lead groups are connected to wiring patterns in a package 27, and outer leads 26b bent in an L shape are extended in one direction of the package 27.