| 摘要 |
PURPOSE:To obtain a lead frame in which positioning can be accurately conducted in the case of processing, electric various characteristics are provided in a state that a semiconductor device is coupled to the frame. CONSTITUTION:A lead frame 11 is formed by supporting inner frames 17A-17D to outer ends of outer leads 14, forming a plurality of positioning holes 19A, 19B and 19C at the frames 17A-17D, and coupling such lead pattern 30 to inner ends of coupling frames 21A, 21B by a hanging lead 23 having a strong strength and a hanging lead 24 having a weak strength at its outer periphery. Thus, at the time of a burn-in testing step, the pattern 30 is supported in a floated state only by the lead 24, and hence a positional relationship between the lead 14 and an electrode of a socket is not affected by influence of thermal expansion of the frames 21A, 21B. |
