| 摘要 |
<p>PURPOSE:To obtain a low-cost device capable of efficiently relieving a heat generation of a semiconductor in a simple structure concerning a semiconductor device for mounting the semiconductor with a large heat generation such as a large power semiconductor device. CONSTITUTION:Circuit conductors 2A, 2B and 2C for mounting a semiconductor device 3 are stacked on one side of a ceramic insulator 1 and are joined. Also, rear members 2a and 2b are stacked on the other opposed side of the ceramic insulator 1 and are joined. At least either the circuit conductors or the rear members are formed of a stacked structure having water channels 20 capable of passing a liquid through the inside. The stacked structure is formed of an alloy constrained member consisting mainly of copper member and molybdenum or tungsten.</p> |
