| 摘要 |
PURPOSE:To implement a multi-chip module having a high reliability and a low cost, by connecting a plurality of LSI or IC chips on a wiring board and forming the multi-chip module having input/output signal pins and a heat sink in a simple structure. CONSTITUTION:A multi-chip module has a structure in which a plurality of LSI or IC chips 2 having a bare chip state are connected on a wiring board 1 and input/output signal pins 3 are soldered and then a heat conductive material 4 and a heat sink 5 for heat dissipation are connected on the LSI or IC chips 2 with a sealer 6. For example, by forming the heat conductive material 4 with the same solder 7 as the sealer 6 of the heat sink 5, a treatment in which the entire chips are hermetically sealed by connecting the circumference of the heat sink 5 to a substrate and a thermal connecting treatment of the chips 2 with the heat sink 5 through the heat conductive material 4 can be simultaneously performed, and the multi-chip module in which a process is simplified is implemented. Also, the heat conductive material 4 can be formed with a resin having good heat transfer characteristics. |
