| 摘要 |
<p>PURPOSE:To realize a circuit board in which an electronic component having a large number of fine leads can be soldered positively to the lands. CONSTITUTION:Lands 2, 3 to be soldered with the leads of an electronic component have top profiles composed of elongated narrow parts 2b, 3b, and parts 2a, 2a, 3a, 3a projecting laterally from long sides 2A, 2A, 3A, 3A extending in the logitudinal direction of the narrow parts 2b, 3b. Solder fused on the lands 2, 3 is attracted to the wide parts 2c, 3c of the lands 2, 3 and bulges locally to come into contact with a floating lead thus securing the lead positively to the lands 2, 3.</p> |
