| 摘要 |
PURPOSE:To provide a wiring of the structure with which the thermal diffusion of gold into a diffusion layer in a wiring, which s mainly composed of gold and having a barrier layer on the bottom face and the structure with which the adhesiveness between a wiring and the insulating film surrounding it is not impaired by the thermal diffusion into the gold of the metal constituting a barrier layer. CONSTITUTION:A first layer of wiring is composed of the main material of golds 4a and 7a, titanium/tungsten 5a which directly brought into contact with an inorganic insulating film 3a containing a contact hole 2, platium 6a with which the above-mentioned titanium/tungsten 5a is covered, and titanium/ tungsten 5b which directly comes in contact with the gold 7a. |
