摘要 |
PURPOSE:To obtain a multilayer printed wiring board excellent in dimensional stability, drilling properties, and mechanical characteristics in which interlayer positional shift and shift of land at the time of drilling are prevented. CONSTITUTION:In a multilayer printed wiring board 7 produced by laminating prepregs 6 and outer layer copper foils 5 onto an inner layer plate having circuits 3 on the surfaces of an insulating layer 2 and then hot pressing the entirety, prepregs of woven and nonwoven glass fabric 1, 2 are employed as the inner layer plate insulating prepreg whereas a prepreg produced by impregnating a woven glass fabric with heat resistant resin and drying is employed as a prepreg 6 to be laminated on the inner layer plate and an outer layer copper foil. |