发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE:To obtain a multilayer printed wiring board excellent in dimensional stability, drilling properties, and mechanical characteristics in which interlayer positional shift and shift of land at the time of drilling are prevented. CONSTITUTION:In a multilayer printed wiring board 7 produced by laminating prepregs 6 and outer layer copper foils 5 onto an inner layer plate having circuits 3 on the surfaces of an insulating layer 2 and then hot pressing the entirety, prepregs of woven and nonwoven glass fabric 1, 2 are employed as the inner layer plate insulating prepreg whereas a prepreg produced by impregnating a woven glass fabric with heat resistant resin and drying is employed as a prepreg 6 to be laminated on the inner layer plate and an outer layer copper foil.
申请公布号 JPH0677657(A) 申请公布日期 1994.03.18
申请号 JP19920247346 申请日期 1992.08.24
申请人 TOSHIBA CHEM CORP 发明人 SATO NORIYUKI;FUKUKAWA HIROSHI
分类号 H05K3/46;H05K1/03;(IPC1-7):H05K3/46 主分类号 H05K3/46
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