发明名称 Semiconductor device
摘要 A semiconductor device which comprises an insulating flexible substrate having conductors extending on one side of the foil from the edge to near the center. A semiconductor element is connected with its contacts connected to the ends of the conductors at the center of the foil. On the side of the foil remote from the conductors a reinforcement member is provided which is present at least near the edges of the foil, the reinforcement member being connected in an adhering manner to the foil and having a pre-shaped contour so as to bend the foil in such manner that the surface of the semiconductor element remote from the foil and the ends of the conductors situated near the edges of the foil are situated substantially in the same plane.
申请公布号 US4215359(A) 申请公布日期 1980.07.29
申请号 US19780958769 申请日期 1978.11.08
申请人 U S PHILIPS CORP 发明人 BREUNING, PAUL;SCHERMER, GIJSBERTUS J H
分类号 H01L23/50;H01L21/60;H01L23/13;H01L23/498;(IPC1-7):H01L23/48 主分类号 H01L23/50
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