| 摘要 |
PURPOSE:To provide a method of manufacturing a semiconductor device, where a spacer is always located just under a semiconductor pellet when the pellet is mounted after granular spacer-containing solder is fed to a heat dissipating plate and scrubbed by pressure with a stirring pin. CONSTITUTION:A semiconductor device B is provided, where a semiconductor pellet 3 is mounted on a heat dissipating plate 1 through the intermediary of a granular spacer 4-containing solder 2, and a spacer 4 is arranged concentrating on a region of the heat dissipating plate 1 excluding a part located just under the heat releasing part of the pellet 3. The semiconductor pellet 3 is mounted through such a method that solder 2 fed onto the heat dissipating plate l is stirred by a stirring pin 6 and scrubbed by pressure with the stirring face 6a of the stirring pin 6 to be spread, where a square frame-like groove 6b whose outer shape is slightly smaller than that of a pellet is provided to the stirring face 6a, the spacer 4 is arranged inside the groove and a square frame inner region groove 6b, and then the pellet 3 is mounted. A groove may be formed into a spiral shape or a radial spiral shape.
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