MOUNTING METHOD FOR CHIP FOR SENSOR

摘要

PURPOSE:To obtain a method capable of mounting a chip for a sensor on a base, while evading chip strain which damages normal sensor function. CONSTITUTION:A chip 1 for a sensor has a thick part 1a and a thin part 1b. The rear side of the thin part forms a space opened toward the rear. A sensitive part 11 is arranged at the thin part. The rear of the chip 1 is die-bonded to the surface of a base 2. In this case, a breathing means 21 is arranged on the base, which means links the space to the outside in the state that the chip 1 is mounted on a specified position of the base. The die-bonding is performed in the state that the space is linked to the outside by the breathing means.