ELECTROSTATIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE,申请号JP19910001397-传众专利搜索

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发明名称	ELECTROSTATIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH0677503(A)	申请公布日期	1994.03.18
申请号	JP19910001397	申请日期	1991.01.10
申请人	FUJI ELECTRIC CO LTD	发明人	MURAMATSU YOSHIHISA
分类号	H01L21/02;G01L9/00;G01L9/04;H01L29/84;(IPC1-7):H01L29/84	主分类号	H01L21/02
代理机构		代理人
主权项
地址

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