Sonic test device e.g. for soldered joints - has passive transducer allowing rapid scanning of medium e.g. joint

摘要

A sonic test device has a transducer (1) which consists of at least one radiation-reflective surface forming part of a paraboloid or a cylindrical surface of parabolic curvature. The reflective surface unites parallel incident rays at its focal point or line and radiates parallel rays from its focal point or line which is located outside the beam cross-section of the parallel incident and emitted rays. The incident rays come from a frame-mounted radiation source (27) spaced from the transducer (1). A medium (24) is arranged near the transducer (1) such that the transducer focal point or line is accurately located on the surface of the medium for interaction of the radiation with the medium and/or radiation from points or lines of the medium surface is incident on the transducer and, after reflection, is incident as parallel rays on a frame-mounted detector (27) spaced from the transducer (1). USE/ADVANTAGE - For (ultra)sonic testing e.g. of joints such as soldered or adhesively bonded joints, e.g. ultrasonic testing of soldered joints in electronics. The device allows sonic scanning without contact between the transducer and the medium. The transducer is passive (i.e. no energy leads are required) and provides a high sound energy density on the medium. The relative velocity of the transducer and the medium can be high.