Verfahren zur Justage von Halbleiterscheiben zueinander

摘要

A ball (6) is placed with one portion of its defined diameter into a recess (5) of a first semi-conductor plate (1) with the other portion of its diameter then being brought into contact with a corresponding recess (5) of the second semi-conductor plate (2) so that alignment of the two semi-conductor plates relative to one another is achieved with the aid of the ball. The completed device is used as a sensor.