| 发明名称 |
Wire bonding over the active circuit area of an integrated circuit device. |
| 摘要 |
<p>Wire bonding over the active circuit (13) of an integrated circuit device (10) is accomplished by providing a layer of a polyimide material (23) in overlying relationship relative to the active circuit, depositing a bonding pad (31) on the polyimide layer opposite the active circuit, connecting the bonding pad electrically to the active circuit, and bonding a wire (33) to the bonding pad. <IMAGE></p> |
| 申请公布号 |
EP0587442(A2) |
申请公布日期 |
1994.03.16 |
| 申请号 |
EP19930307165 |
申请日期 |
1993.09.10 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
HEINEN, KATHERINE G.;ALFARO,RAFAEL VERITY INSTRUMENTS INC.;STIERMAN, ROGER J. |
| 分类号 |
H01L21/28;H01L21/60;H01L21/768;H01L23/485;H01L23/522;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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