Multi-level circuit structure.

摘要

A multi-level circuit structure (50) is provided which includes a plurality of overlying substrates, each having at least one conductive core (10). A plurality of imprinted deformations are formed in each substrate, each deformation having a convex surface (14) and a concave surface (16). Dielectric coatings (18) are utilized to provide insulation between adjacent substrates and by selectively placing a conductive mass between selected overlying imprinted deformations an electrical connection may be formed between adjacent imprinted deformations wherein selected portions of one substrate may be electrically coupled to selected portions of a second substrate.