发明名称 |
Semiconductor device |
摘要 |
A plurality of circuit boards are used and frames are attached to the circuit boards to surround the peripheral portions thereof. Since connection terminals electrically connected to the respective circuit boards are attached to the respective frames, a semiconductor device having semiconductor elements mounted at high density can be formed by stacking the first and second frames on each other and setting the respective connection terminals in contact with each other to electrically connect the circuit boards to each other.
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申请公布号 |
US5295044(A) |
申请公布日期 |
1994.03.15 |
申请号 |
US19920950899 |
申请日期 |
1992.09.25 |
申请人 |
TOKYO SHIBAURA ELECTRIC CO |
发明人 |
ARAKI, KOUJI;KOJIMA, SHINJIRO;TAKAHASHI, WATARU |
分类号 |
H01L25/00;H01L23/24;H01L23/538;H01L25/065;H05K7/02;(IPC1-7):H05K7/20 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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