| 摘要 |
PURPOSE:To provide a method for forming an adhesive layer on a printed wiring board by using a dry film whereby an adhesive can be continuously applied to printed wiring boards by means of a simple structure. CONSTITUTION:This bonding method comprises continuously supplying a dry film 10 to a plurality of succeedingly delivered printed wiring boards 5, releasing a protective film 1 from the dry film 10, applying masking tapes 13 at intervals to an adhesive 2, each masking tape 13 being situated on the upper margin of the part where the two given printed wiring boards adjoin, heat-pressing the adhesive 2 together with a base film 12 to the printed wiring board 5, and releasing the base film 12 in a state adhered to the masking tape 13 from the adhesive 2 on the printed wiring board. |
