发明名称 Semiconductor integrated circuit capable of correcting wiring skew
摘要 A plurality of standard cells are placed on a semiconductor substrate. A first aluminum wiring layer is connected to those standard cells. Below the first aluminum wiring layer, a second wiring layer is formed which is not connected to the standard cells and which, together with the first wiring layer, forms a capacitor. Between the first and second aluminum wiring layers, an insulating layer is formed. Wiring skew is adjusted by making through-holes in the insulating layer, and connecting the first and second aluminum wiring layers to each other via as many through-holes as required to vary the capacitance between them.
申请公布号 US5294837(A) 申请公布日期 1994.03.15
申请号 US19920978046 申请日期 1992.11.18
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 TAKASE, SHINSUKE;HASHIMOTO, HISASHI
分类号 H01L27/04;H01L21/02;H01L21/82;H01L21/822;H01L23/522;H01L23/528;H01L29/92;(IPC1-7):H01L23/48;H01L29/44 主分类号 H01L27/04
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