发明名称 MANUFACTURE OF MULTILAYER CIRCUIT BOARD
摘要 PURPOSE:To raise the reliability on electric connection as compared with the case of bringing a film-shaped metallic foil into contact with it, by providing an electrically conductive solution-form paste layer on a signal takeout part or a surface conductor layer, and supplying power through this paste layer. CONSTITUTION:This board comprises a ceramic board 1, a conductor layer 3, which is formed on the surface of the ceramic board 1 or on the surface through an insulating layer, and a signal takeout part, which is connected electrically to the conductor layer 3. What is more, the signal takeout part is provided with a signal takeout pin 2. Moreover, the signal takeout part is provided with a paste layer by applying electrically conductive paste 4, and electrolytic plating is performed by supplying the conductor layer 3 with power through the paste layer and the signal takeout part. And, the thickness of the conductor layer 3 is controlled by forming a plated layer on the surface of the conductor layer 3, and then the paste layer is removed. Hereby, favorable electrolytic plating of the signal takeout part can be performed.
申请公布号 JPH0669370(A) 申请公布日期 1994.03.11
申请号 JP19920216932 申请日期 1992.08.14
申请人 NGK INSULATORS LTD 发明人 SHIBATA KAZUYOSHI;HAMA SUSUMU
分类号 H01L23/12;H05K3/46;(IPC1-7):H01L23/12 主分类号 H01L23/12
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