| 摘要 |
1,110,535. Semi-conductor devices. CORNING GLASS WORKS. 23, Nov. 1965 [2 Dec., 1964], No. 49710/65. Heading H1K. [Also in Division B3] In bonding a semi-conductor device to a printed circuit the device having one or more contact areas is arranged opposite the printed circuit having a corresponding number of contact areas, a conductive pillar is disposed between the or each pair of contact areas and force and vibratory energy are applied to the unit so formed to weld the pillar or pillars to the contact areas. A glass, ceramic, glassceramic or plastic substrate 10, Fig. 1, has conductive members 12, 14, 16 formed thereon and in contact with the contact areas at the ends of the members are arranged aluminium or copper pillars 32, 34, 36 engaged in turn by the metal emitter, collector and base electrodes 24, 26, 28 vapour deposited or metallized on a planar type transistor chip 30. The assembly is arranged between the anvil 38, Fig. 2, and vibratory member 40 which apply force and vibratory energy to weld the pillars to the contact areas. |
